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Reliability aspects of copper metallization and interconnect technology for power devices

Author:

Frank Hille,Roman Roth,Carsten Schäffer,Holger Schulze,Nicolas Heuck,Daniel Bolowski,Karsten Guth,Alexander Ciliox,Karina Rott,Frank Umbach,Martin Kerber

Publication:

Microelectronics Reliability

Publisher:

Elsevier

Date:

September 2016

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