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Annealing-free adhesive electroless deposition of a nickel/phosphorous layer on a silane-compound-modified Si wafer

Author:

Tzu-Chien Wei,Tseng-Chieh Pan,Chih-Ming Chen,Kuei-Chang Lai,Chung-Han Wu

Publication:

Electrochemistry Communications

Publisher:

Elsevier

Date:

May 2015

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