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Effect of stress interruption on TDDB lifetime during constant voltage stressing in metal-ferroelectric-insulator-semiconductor ferroelectric devices

Author:

Tiang Teck Tan,Tian-Li Wu,Hsien-Yang Liu,Cheng-Yu Yu,Kalya Shubhakar,Nagarajan Raghavan,Kin Leong Pey

Publication:

Microelectronics Reliability

Publisher:

Elsevier

Date:

February 2025

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