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Atomic-scale characterization of interfacial Cu-Zn/Al-Zn solid solutions in low-temperature Cu/Al joints soldered with chain-length tailored fluxes via FIB-TEM

Author:

Ruofan Wang,Yanfu Yan,Xuemeng Zhou,Gangjian Li,Zheng Wu,Shaowu Dai

Publication:

Materials Characterization

Publisher:

Elsevier

Date:

August 2026

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