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Thickness-dependent microstructure evolution and mechanical properties of electrodeposited copper foils

Author:

Gang Dong,Yuehong Zheng,Fangchen Liu,Bowen Fu,Zhumin Li,Zhengze Pan,Chong Luo,Faqi Zhan,Min Zhu,Wenwen Ma,Shipeng Xu,Peiqing La

Publication:

Journal of Materials Research and Technology

Publisher:

Elsevier

Date:

May–June 2026

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