Rightslink® by Copyright Clearance Center

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Author:

Yue Gao,Wanli Li,Chuantong Chen,Hao Zhang,Jinting Jiu,Cai-Fu Li,Shijo Nagao,Katsuaki Suganuma

Publication:

Materials & Design

Publisher:

Elsevier

Date:

15 December 2018

Please select your organization and/or account

Organization

Account

Please select your account from the above dropdown list. These accounts represent the offices, campuses, and other sites where your organization operates. Your account selection should match where you typically have an office or workspace. Even when you are traveling or temporarily working elsewhere, you should select the account that represents where you customarily work.

Cancel OK

Welcome to RightsLink

Elsevier has partnered with Copyright Clearance Center's RightsLink service to offer a variety of options for reusing this content.

I would like to...This drop down menu contains the options the publisher has agreed to permit for reuse of their copyrighted material. The publisher offers these types of use either directly through RightsLink or after approval by the publisher. Please reference the terms and conditions offered during the order process for a complete understanding of the use you select. Need more info?