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Microstructural regulation via dynamic offsets and shear force adjustment cryorolling to fabricate Cu-Sn alloy breaking the strength-conductivity trade-off

Author:

Xin Xue,Longfei Xu,Jinfu Zhao,Ling Kong,Ligang Liu,Renhao Wu,Yuhui Wang,Hyoung Seop Kim

Publication:

Journal of Materials Processing Technology

Publisher:

Elsevier

Date:

April 2026

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