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Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging

Author:

Junjie Cheng,Wenpeng Duan,Qiguang Liu,Chang Jing,Zhenfeng Zhu,Jue Cheng,Jiahao Ma,Junying Zhang

Publication:

Chemical Engineering Journal

Publisher:

Elsevier

Date:

15 March 2026

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