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Atomic-scale study of Cu3Sn and Cu6Sn5 intermetallic layers growth after soldering

Author:

Farzad Khodabakhshi,Irina Wodak,Shabnam Taheriniya,Andriy Yakymovych,Michael K. Eusterholz,Gerhard Wilde,Golta Khatibi

Publication:

Materials & Design

Publisher:

Elsevier

Date:

June 2026

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