Thermo-mechanical reliability and scalability of copper-pillar solder-cap interconnects for micro-LEDs
Author:
Junhyeock Kim,Ho-Jung Jeong,Dae-Myeong Geum,Yong Suk Oh,Min-Su Park,Joonhyub Kim,Daewoong Jung,Chang-Mo Kang
Publication:
Microelectronics Reliability
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