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Phase structure of Cu3Sn/Cu and formation of monoclinic Cu grain at this interface during aging

Author:

Dongdong Chen,Xin Zhang,Jinmei Lv,Junhu Qin,Jianhong Yi,Jikang Yan,Caiju Li,Congyan Leng,Hailong Bai,Shaofu Sun, Lingyan zhao

Publication:

Intermetallics

Publisher:

Elsevier

Date:

November 2023

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