Sintered metal alloy and composite as bonding materials for electronics applications
Author:
W.J. Wang,Anuttam Patra,Ling Xin Yong,Xu Long,Qiang Jia,Lu Shen,K.S. Siow
Publication:
Journal of Materials Research and Technology
Date:
September–October 2025
© 2025 The Authors. Published by Elsevier B.V.