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High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

Author:

Jung-Pyo Hong,Sung-Woon Yoon,Taeseon Hwang,Joon-Suk Oh,Seung-Chul Hong,Youngkwan Lee,Jae-Do Nam

Publication:

Thermochimica Acta

Publisher:

Elsevier

Date:

10 June 2012

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