Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
Author:
Byung-Suk Lee,Yong-Ho Ko,Jung-Hwan Bang,Chang-Woo Lee,Sehoon Yoo,Jun-Ki Kim,Jeong-Won Yoon
Publication:
Microelectronics Reliability
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